Localized soldering by inductive heating

Author(s)
Author(s)
Oien, M. A.
Date Issued
1991-01-08
Abstract
Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.
Description
United States Patent No.: 4,983,804
URI
SFU Affiliated Publication
No
Availability at SFU Library

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