Chan, Anthony Hing-HungAnthony Hing-HungChanOien, M. A.2022-06-242022-06-241991-01-08https://repository.sfu.edu.hk/handle/sfu/3509United States Patent No.: 4,983,804Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.entechnical documentation