Requirements of advanced packaging curriculum
Author(s)
Author(s)
Selvaduray, G.
Becker, J. F.
Date Issued
2003
Publisher
IEEE
Related Publication(s)
Proceedings of the 4th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2003)
Start page
155
End page
160
SFU Affiliated Publication
No
Availability at SFU Library
No database links found.